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200/400/800G/1.6T Custom

200/400/800G/1.6T Custom

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  • Customized 800GBASE-DR4 OSFP224 RHS/Flat Top 4 x 200G PAM4 1310nm 500m MPO-12/APC SMF Transceiver Module

  • Customized 800GBASE-DR4 OSFP224 RHS/Flat Top 4 x 200G PAM4 1310nm 500m MPO-12/APC SMF Transceiver Module

  • Customized 800GBASE-DR4 OSFP224 RHS/Flat Top 4 x 200G PAM4 1310nm 500m MPO-12/APC SMF Transceiver Module

  • Customized 800GBASE-DR4 OSFP224 RHS/Flat Top 4 x 200G PAM4 1310nm 500m MPO-12/APC SMF Transceiver Module

Customized 800GBASE-DR4 OSFP224 RHS/Flat Top 4 x 200G PAM4 1310nm 500m MPO-12/APC SMF Transceiver Module

Description:

Customized 800GBASE-DR4 OSFP224 RHS/Flat Top 4 x 200G PAM4 1310nm 500m MPO-12/APC SMF Transceiver Module

Features:

Product Highlights

Built-in Broadcom DSP Chip, Max. Power Consumption 16W
Parameter Tests for Superior Performance, Quality, and Reliability
106G EML Laser Chip Support High-frequency Response with Minimal Signal Distortion
High-speed Connectivity Compliant with IEEE 802.3dj and CMIS v5.2
Hot Pluggable OSFP MSA Compliant
See more

Specifications

Specifications
Part Number
OSFP224-DR4-800G-FL
Vendor Name
FS
Form Factor
Single-port OSFP RHS/Flat Top
Max Data Rate
850Gbps
Wavelength
1310nm
Max Cable Distance
500m
Connector
MPO-12/APC
Media
SMF
Transmitter Type
EML
Receiver Type
PIN
TX Power
-3.3~4dBm
Minimum Receiver Power
-6.3dBm
Power Budget
3dB
Receiver Overload
4dBm
Max Power Consumption
16W
Extinction Ratio
3.5dB
Modulation (Electrical)
4x200G-PAM4
Modulation (Optical)
4x200G-PAM4
Packaging Technology
COB (Chip on Board) Packaging
DSP
Broadcom
Inbuilt FEC
Yes
Commercial Temperature Range
0 to 70°C (32 to 158°F)
Protocols
IEEE 802.3dj, OSFP MSA Specification Rev 5.1, CMIS Rev 5.2
Warranty
5 Years

Detailed

800GBASE-DR4 OSFP224 PAM4 Optical Transceiver Module (SMF, 1310nm, 500m, MPO-12/APC, DOM, RHS/Flat Top)

The 800GBASE-DR4 OSFP224 Optical Transceiver Module is designed for 800GBASE Ethernet throughput up to 500m lengths over single-mode fiber (SMF) with MPO-12 connectors. This transceiver is compliant with IEEE 802.3dj, CMIS Rev 5.2 and OSFP MSA Specification Rev 5.1. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters. It's suitable for 800G Ethernet, Breakout 4x200G DR, Data Centers and Cloud Networks and supports interconnection between the same type of modules.


Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.

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