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200/400/800G/1.6T Custom

200/400/800G/1.6T Custom

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  • Customized 800GBASE-DR8 OSFP IHS/Finned Top 8 x 100G PAM4 1310nm 500m MPO-16/APC SMF Transceiver Module

  • Customized 800GBASE-DR8 OSFP IHS/Finned Top 8 x 100G PAM4 1310nm 500m MPO-16/APC SMF Transceiver Module

  • Customized 800GBASE-DR8 OSFP IHS/Finned Top 8 x 100G PAM4 1310nm 500m MPO-16/APC SMF Transceiver Module

  • Customized 800GBASE-DR8 OSFP IHS/Finned Top 8 x 100G PAM4 1310nm 500m MPO-16/APC SMF Transceiver Module

Customized 800GBASE-DR8 OSFP IHS/Finned Top 8 x 100G PAM4 1310nm 500m MPO-16/APC SMF Transceiver Module

Description:

Customized 800GBASE-DR8 OSFP IHS/Finned Top 8 x 100G PAM4 1310nm 500m MPO-16/APC SMF Transceiver Module

Features:

Product Highlights

Built-in Broadcom 7nm DSP Chip, Max. Power Consumption 16.5W
Self-developed 53G EML Laser Chip to Ensure Production
Parameter Tests for Superior Performance, Quality, and Reliability
Support 2x 400G, 8x 100G Breakout for Higher Port Density
8x 106.25G PAM4 Retimed 8x 100GAUI-1 C2M Elecctrical Interface
See more

Specifications

Specifications
Part Number
OSFP800-DR8-B1
Vendor Name
FS
Form Factor
Single-port OSFP IHS/Finned Top
Max. Data Rate
850Gbps (8x 106.25Gbps)
Wavelength
1310nm
Max. Cable Distance
500m
Connector
MPO-16/APC
Media
SMF
Transmitter Type
EML
Receiver Type
SiFotonics PD array
TX Power
-2.9~4.0dBm
Minimum Receiver Power
-5.9dBm
Power Budget
3dB
Receiver Overload
4dBm
Max. Power Consumption
16.5W
Extinction Ratio
>3.5dB
Modulation (Electrical)
8x 100G-PAM4
Modulation (Optical)
8x 100G-PAM4
Packaging Technology
COB (Chip on Board) Packaging
Modulation Format
PAM4
CDR (Clock and Data Recovery)
TX and RX Built-in DSP
Inbuilt FEC
No
Protocols
OSFP MSA, CMIS Rev 5.0, IEEE P802.3ck and IEEE 802.3cu
Warranty
5 Years

Detailed

Customized 800GBASE-DR8 OSFP PAM4 Optical Transceiver Module (SMF, 1310nm, 500m, MTP/MPO-16, DOM, IHS/Finned Top)

The 800GBASE-DR8 OSFP Optical Transceiver Module is designed for 800GBASE Ethernet throughput up to 500m over OS2 single-mode fiber (SMF) using a wavelength of 1310nm via MPO-16 connectors. This transceiver is compliant with lEEE P802.3ck, IEEE 802.3cu, OSFP MSA. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters.
The OSFP finned-top transceiver is used in Ethernet air-cooled switches. Featured with low latency, low power, and reliability, it can link upward in spine-leaf architectures for switch-to-switch applications, downward for top-of-rack switch links to Ethernet network adapters, and/or to BlueField-3 DPUs in compute servers and storage subsystems. It is the ideal solution for HPC computing, AI, and cloud data centers.


Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.

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